3D-AXI Automated X-ray Inspection The X950 is the first in the VT series to support clean rooms for mid-process semiconductors where wafer-to-wafer bonding processes occur. It is also equipped with a function that automatically changes inspection settings to accommodate sudden changes in production items due to fluctuating demand. The system automatically changes conditions by referencing measurement points and inspection settings registered in advance in the production control system that are appropriate for each production item. This reduces start-up losses and re-setting of inspection settings.